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| Features * Six Half-bridge Outputs Formed by Six High-side and Six Low-side Drivers * Capable of Switching all Kinds of Loads (Such as DC Motors, Bulbs, Resistors, * * * * * * * * * * * * Capacitors and Inductors) RDSon Typically 1.0 at 25C, Maximum 2.2 at 200C Up to 650-mA Output Current Very Low Quiescent Current IS < 20 A in Standby Mode Outputs Short-circuit Protected Overtemperature Prewarning and Protection Undervoltage Protection Various Diagnosis Functions Such as Shorted Output, Open Load, Overtemperature and Power Supply Fail Serial Data Interface Operation Voltage up to 40V Daisy Chaining Possible Serial Interface 5V Compatible, up to 2 MHz Clock Frequency QFN24 Package 1. Description The ATA6837 is designed for high-temperature applications. In mechatronic solutions, for example, turbo charger or exhaust gas recirculation systems, many flaps have to be controlled by DC motor driver ICs which are located very close to the hot engine or actuator and where ambient temperatures up to 150C are usual. Due to the advantages of SOI technology, junction temperatures up to 200C are allowed. This enables new cost-effective board design possibilities to achieve complex mechatronic solutions. The ATA6837 is a fully protected hex half-bridge driver, used to control up to 6 different loads by a microcontroller in automotive and industrial applications. Each of the six high-side and six low-side drivers is capable of driving currents up to 650 mA. The drivers are internally connected to form 6 half-bridges and can be controlled separately from a standard serial data interface. Therefore, all kinds of loads, such as bulbs, resistors, capacitors and inductors, can be combined. The IC especially supports the application of H-bridges to drive DC motors. Protection is guaranteed in terms of short-circuit conditions, overtemperature and undervoltage. Various diagnosis functions and a very low quiescent current in standby mode make a wide range of applications possible. Automotive qualification referring to conducted interferences, EMC protection and ESD protection gives added value and enhanced quality for the exacting requirements of automotive applications. High Temperature Hex Half-bridge Driver with Serial Input Control ATA6837 4953F-AUTO-02/10 Figure 1-1. Block Diagram QFN24 S I S C T O L D H S 6 L S 6 H S 5 L S 5 H S 4 L S 4 H S 3 L S 3 H S 2 L S 2 H S 1 L S 1 S R R 3, 4 VS Input register Ouput register Serial interface Charge pump L S 1 T P DI 19 P S F I N H S C D H S 6 L S 6 H S 5 L S 5 H S 4 L S 4 H S 3 L S 3 H S 2 L S 2 H S 1 CLK 18 CS 17 INH 12 DO 13 Control logic Power on reset 24 GND Fault Detect Fault Detect Fault Detect Fault Detect Fault Detect Fault Detect Fault Detect Fault Detect Fault Detect Fault Detect Fault Detect Fault Detect UV protection 14 VCC 16 GND Thermal protection 15 GND 7 11 OUT1 8 OUT2 5 OUT3 2 OUT4 23 OUT5 20 OUT6 GND 2 ATA6837 4953F-AUTO-02/10 ATA6837 2. Pin Configuration Figure 2-1. Pinning QFN 24, 5 x 5, 0.65 mm pitch NC OUT5 OUT5 SENSE OUT6 SENSE OUT6 DI OUT4 SENSE OUT4 VS VS OUT3 OUT3 SENSE 1 2 3 4 5 6 24 23 22 21 20 19 18 17 16 15 14 13 7 8 9 10 11 12 CLK CS GND SENSE NC VCC DO Note: YWW ATAxyz ZZZZZ AL Date code (Y = Year above 2000, WW = week number) Product name Wafer lot number Assembly sub-lot number Table 2-1. Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Pin Description QFN24 Symbol Function Half-bridge output 4; formed by internally connected power MOS high-side switch 4 and low-side switch 4 with internal reverse diodes; short circuit protection; overtemperature protection; diagnosis for short and open load Power supply output stages HS4, HS5 and HS6 Power supply output stages HS1, HS2 and HS3 Output 3; see pin 1 Internal bond to GND Output 2; see pin 1 OUT4 SENSE Only for testability in final test OUT4 VS VS OUT3 NC OUT2 OUT3 SENSE Only for testability in final test OUT2 SENSE Only for testability in final test OUT1 SENSE Only for testability in final test OUT1 INH DO VCC NC Output 1; see pin 1 Inhibit input; 5V logic input with internal pull down; low = standby, high = normal operation Serial data output; 5V CMOS logic level tri-state output for output (status) register data; sends 16-bit status information to the microcontroller (LSB is transferred first). Output will remain tri-stated unless device is selected by CS = low, therefore, several ICs can operate on one data output line only Logic supply voltage (5V) Internal bond to GND GND SENSE Ground; reference potential; internal connection to the lead frame; cooling tab NC OUT2 OUT2 SENSE OUT1 SENSE OUT1 INH 3 4953F-AUTO-02/10 Table 2-1. Pin 17 18 19 20 21 22 23 24 Pin Description QFN24 (Continued) Symbol CS CLK DI OUT6 Function Chip select input; 5V CMOS logic level input with internal pull up; low = serial communication is enabled, high = disabled Serial clock input; 5V CMOS logic level input with internal pull down; controls serial data input interface and internal shift register (fmax = 2 MHz) Serial data input; 5V CMOS logic level input with internal pull down; receives serial data from the control device; DI expects a 16-bit control word with LSB being transferred first Output 6; see pin 1 OUT6 SENSE Only for testability in final test OUT5 SENSE Only for testability in final test OUT5 NC Output 5; see pin 1 Internal bond to GND 4 ATA6837 4953F-AUTO-02/10 ATA6837 3. Functional Description 3.1 Serial Interface Data transfer starts with the falling edge of the CS signal. Data must appear at DI synchronized to CLK and is accepted on the falling edge of the CLK signal. LSB (bit 0, SRR) has to be transferred first. Execution of new input data is enabled on the rising edge of the CS signal. When CS is high, pin DO is in a tri-state condition. This output is enabled on the falling edge of CS. Output data will change their state with the rising edge of CLK and stay stable until the next rising edge of CLK appears. LSB (bit 0, TP) is transferred first. Figure 3-1. CS Data Transfer Input Data Protocol DI SRR 0 LS1 1 HS1 2 LS2 3 HS2 4 LS3 5 HS3 6 LS4 7 HS4 8 LS5 9 HS5 10 LS6 11 HS6 12 OLD 13 SCT 14 15 SI CLK DO TP SLS1 SHS1 SLS2 SHS2 SLS3 SHS3 SLS4 SHS4 SLS5 SHS5 SLS6 SHS6 SCD INH PSF Table 3-1. Bit 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 Input Data Protocol Input Register SRR LS1 HS1 LS2 HS2 LS3 HS3 LS4 HS4 LS5 HS5 LS6 HS6 OLD SCT Function Status register reset (high = reset; the bits PSF, SCD and overtemperature shutdown in the output data register are set to low) Controls output LS1 (high = switch output LS1 on) Controls output HS1 (high = switch output HS1 on) See LS1 See HS1 See LS1 See HS1 See LS1 See HS1 See LS1 See HS1 See LS1 See HS1 Open load detection (low = on) Programmable time delay for short circuit (shutdown delay high/low = 12 ms/1.5 ms) Software inhibit; low = standby, high = normal operation (data transfer is not affected by standby function because the digital part is still powered) 15 SI 5 4953F-AUTO-02/10 Table 3-2. Bit 0 Output Data Protocol Output (Status) Register TP Function Temperature prewarning: high = warning (overtemperature shutdown see remark below) Normal operation: high = output is on, low = output is off Open-load detection: high = open load, low = no open load (correct load condition is detected if the corresponding output is switched off) Normal operation: high = output is on, low = output is off Open-load detection: high = open load, low = no open load (correct load condition is detected if the corresponding output is switched off) Description see LS1 Description see HS1 Description see LS1 Description see HS1 Description see LS1 Description see HS1 Description see LS1 Description see HS1 Description see LS1 Description see HS1 Short circuit detected: set high, when at least one output is switched off by a short circuit condition Inhibit: this bit is controlled by software (bit SI in input register) and hardware inhibit (pin INH). High = standby, low = normal operation Power supply fail: undervoltage at pin VS detected 1 Status LS1 2 Status HS1 3 4 5 6 7 8 9 10 11 12 13 14 15 Note: Status LS2 Status HS2 Status LS3 Status HS3 Status LS4 Status HS4 Status LS5 Status HS5 Status LS6 Status HS6 SCD INH PSF Bit 0 to 15 = high: overtemperature shutdown Table 3-3. Bit 15 Bit 14 (SI) (SCT) H H Status of the Input Register After Power on Reset Bit 13 (OLD) H Bit 12 (HS6) L Bit 11 (LS6) L Bit 10 (HS5) L Bit 9 (LS5) L Bit 8 (HS4) L Bit 7 (LS4) L Bit 6 (HS3) L Bit 5 (LS3) L Bit 4 (HS2) L Bit 3 (LS2) L Bit 2 Bit 1 (HS1) (LS1) L L Bit 0 (SRR) L 6 ATA6837 4953F-AUTO-02/10 ATA6837 3.2 Power-supply Fail In case of undervoltage at pin VS, an internal timer is started. When during a permanent undervoltage the delay time (tdUV) is reached, the power supply fail bit (PSF) in the output register is set and all outputs are disabled. When normal voltage is present again, the outputs are enabled immediately. The PSF bit remains high until it is reset by the SRR bit in the input register. 3.3 Open-load Detection If the open-load detection bit (OLD) is set to low, a pull-up current for each high-side switch and a pull-down current for each low-side switch is turned on (open-load detection current IHS1-6, ILS1-6). If VVS - VHS1-6 or VLS1-6 is lower than the open-load detection threshold (open-load condition), the corresponding bit of the output in the output register is set to high. Switching on an output stage with OLD bit set to low disables the open load function for this output. 3.4 Overtemperature Protection If the junction temperature exceeds the thermal prewarning threshold, TjPW set, the temperature prewarning bit (TP) in the output register is set. When the temperature falls below the thermal prewarning threshold, TjPW reset, the bit TP is reset. The TP bit can be read without transferring a complete 16-bit data word: with CS = high to low, the state of TP appears at pin DO. After the microcontroller has read this information, CS is set high and the data transfer is interrupted without affecting the state of the input and output registers. If the junction temperature exceeds the thermal shutdown threshold, Tj switch off, the outputs are disabled and all bits in the output register are set high. The outputs can be enabled again when the temperature falls below the thermal shutdown threshold, Tj switch on, and when a high has been written to the SRR bit in the input register. Thermal prewarning and shutdown threshold have hysteresis. 3.5 Short-circuit Protection The output currents are limited by a current regulator. Current limitation takes place when the overcurrent limitation and shutdown threshold (IHS1-6, ILS1-6) are reached. Simultaneously, an internal timer is started. The shorted output is disabled when during a permanent short the delay time (tdSd) programmed by the short-circuit timer bit (SCT) is reached. Additionally, the short-circuit detection bit (SCD) is set. If the temperature prewarning bit TP in the output register is set during a short, the shorted output is disabled immediately and SCD bit is set. By writing a high to the SRR bit in the input register, the SCD bit is reset and the disabled outputs are enabled. 3.6 Inhibit There are two ways to inhibit the ATA6837: * Set bit SI in the input register to 0 * Switch pin INH to 0V In both cases, all output stages are turned off but the serial interface stays active. The output stages can be activated again by bit SI = 1 (when INH = VCC) or by pin INH switched back to VCC (when SI = 1). 7 4953F-AUTO-02/10 4. Absolute Maximum Ratings Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. All values refer to GND pins. Parameters Supply voltage Supply voltage t < 0.5s; IS > -2A Supply voltage difference VS_pin3 - VS_pin4 Logic supply voltage Logic input voltage Logic output voltage Input current Output current Output current Junction temperature range Storage temperature range Ambient temperature range Pin 3, 4 3, 4 3, 4 14 17 - 19 13 12, 17 - 19 13 2, 5, 8, 11, 20, 23 Symbol VVS VVS VVS VVCC VDI, VCLK, VCS VDO IINH, IDI, ICLK, ICS IDO IOUT1 to IOUT6 Tj TSTG Ta Value -0.3 to +40 -1 150 -0.3 to +7 -0.3 to VVCC +0.3 -0.3 to VVCC +0.3 -10 to +10 -10 to +10 Internally limited, see "Output Specification" in Section 7. on page 9 -40 to +200 -55 to +200 -40 to +150 C C C Unit V V mV V V V mA mA 5. Thermal Resistance Table 5-1. Parameter Junction pin Junction ambient QFN24: Depends on the PCB-board Test Conditions Pin 16 Symbol RthJP RthJA Min. Typ. Max. <5 35 Unit K/W K/W 6. Operating Range Parameter Supply voltage Logic supply voltage Logic input voltage Serial interface clock frequency Junction temperature range Test Conditions Pin 3, 4 14 12 , 17 - 19 Symbol VVS VVCC VINH, VDI, VCLK, VCS fCLK Tj -40 Min. VUV(1) 4.75 -0.3 Typ. Max. 40 5.25 VVCC 2 +200 Unit V V V MHz C 8 ATA6837 4953F-AUTO-02/10 ATA6837 7. Electrical Characteristics 7.5V < VS < 40V; 4.75V < VCC < 5.25V; INH = High; -40C < Tj < 200C, Ta 150C; unless otherwise specified, all values refer to GND pins. No. 1 Parameters Current Consumption Total quiescent current (VS and all outputs to VS) VS = 33V VCC = 0V or VCC = 5V, bit SI = low or VCC = 5V, pin INH = low Output pins to VS and GND 4.75V < VVCC < 5.25V, INH or bit SI = low VVS < 28V normal operation, all output stages off VVS < 28V normal operation, all output low stages on, no load VVS < 28V normal operation, all output high stages on, no load 4.75V < VVCC < 5.25V, normal operation VVS = 40V, INH = low Test Conditions Pin Symbol Min. Typ. Max. Unit Type* 1.1 3, 4 IVS 20 A A 1.2 1.3 Quiescent current (VCC) Supply current (VS) 14 3, 4 IVCC IVS 0.8 40 1.2 A mA A A 1.4 Supply current (VS) 3, 4 IVS 10 mA A 1.5 1.6 1.7 2 2.1 3 3.1 3.2 3.3 3.4 3.5 4 4.1 4.2 4.3 4.4 4.5 Notes: Supply current (VS) Supply current (VCC) Discharge current (VS) Frequency (time base for delay timers) 3, 4 14 3, 4 IVS IVCC IVS 16 200 5 mA A mA A A A Internal Oscillator Frequency fOSC 19 45 kHz A Undervoltage Detection, Power-on Reset Power-on reset threshold Power-on reset delay time Undervoltage detection threshold Undervoltage detection hysteresis Undervoltage detection delay Thermal Prewarning and Shutdown Thermal prewarning Thermal prewarning Thermal prewarning hysteresis Thermal shutdown Thermal shutdown TjPWset TjPWreset TjPW Tj switch off Tj switch on 200 185 170 155 195 180 15 225 210 250 235 220 205 C C K C C B B C B B After switching on VVCC 14 14 14 VVCC tdPor VUV VUV tdUV 7 2.3 20 5.5 0.4 21 2.7 95 3.0 180 7.0 V s V V ms A A A A A *) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter 1. Delay time between rising edge of input signal at pin CS after data transmission and switch on/off output stages to 90% of final level. Device not in standby for t > 1 ms. 9 4953F-AUTO-02/10 7. Electrical Characteristics (Continued) 7.5V < VS < 40V; 4.75V < VCC < 5.25V; INH = High; -40C < Tj < 200C, Ta 150C; unless otherwise specified, all values refer to GND pins. No. 4.6 4.7 Parameters Thermal shutdown hysteresis Ratio thermal shutdown/thermal prewarning Ratio thermal shutdown/thermal prewarning Output Specification (LS1-LS6, HS1-HS6) 7.5V < VVS < 40V On resistance IOut = 600 mA 2, 5, 8, 11, 20, 23 2, 5, 8, 11, 20, 23 2, 5, 8, 11, 20, 23 2, 5, 8, 11, 20, 23 2, 5, 8, 11, 20, 23 2, 5, 8, 11, 20, 23 2, 5, 8, 11, 20, 23 2, 5, 8, 11, 20, 23 2, 5, 8, 11, 20, 23 RDS OnL 2.2 A Test Conditions Pin Symbol Tj switch off Tj switch off/ TjPW set Min. Typ. 15 Max. Unit K Type* C C 1.05 1.2 4.8 5 5.1 Tj switch on/ TjPW reset 1.05 1.2 C 5.2 On resistance IOut = -600 mA RDS OnH 2.2 A 5.3 High-side output leakage VOut1-6 = 0V current (total quiescent all output stages off current see 1.1) Low-side output leakage VOut1-6 = VS current (total quiescent all output stages off current see 1.1) Inductive shutdown energy Overcurrent limitation VVS 13V and shutdown threshold Overcurrent limitation VVS 13V and shutdown threshold Overcurrent limitation 20V < VVS < 40V and shutdown threshold Overcurrent limitation 20V < VVS < 40V and shutdown threshold Overcurrent shutdown delay time Overcurrent shutdown delay time High-side open load detection current Input register bit 14 (SCT) = low VVS = 13V Input register bit 14 (SCT) = High VVS = 13V Input register bit 13 (OLD) = low, output off IOut1-6 -60 A A 5.4 IOut1-6 250 A A 5.5 Woutx 15 mJ D 5.6 ILS1-6 650 950 1400 mA A 5.7 IHS1-6 -1400 -950 -650 mA A 5.8 ILS1-6 650 950 1600 mA C 5.9 IHS1-6 -1600 -950 -650 mA C 5.10 tdSd 0.9 1.5 2.1 ms A 5.11 tdSd 2, 5, 8, 11, 20, 23 7 12 17 ms A 5.12 IOut1-3H -1.6 -0.3 mA A *) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter Notes: 1. Delay time between rising edge of input signal at pin CS after data transmission and switch on/off output stages to 90% of final level. Device not in standby for t > 1 ms. 10 ATA6837 4953F-AUTO-02/10 ATA6837 7. Electrical Characteristics (Continued) 7.5V < VS < 40V; 4.75V < VCC < 5.25V; INH = High; -40C < Tj < 200C, Ta 150C; unless otherwise specified, all values refer to GND pins. No. 5.13 Parameters Low-side open load detection current Open load detection current ratio High-side open load detection voltage Low-side open load detection voltage High-side output switch on delay(1) Low-side output switch on delay(1) High-side output switch off delay(1) Low-side output switch off delay(1) Input register bit 13 (OLD) = low, output off Input register bit 13 (OLD) = low, output off VVS = 13V RLoad = 30 VVS = 13V RLoad = 30 VVS =13V RLoad = 30 VVS =13V RLoad = 30 Test Conditions Input register bit 13 (OLD) = low, output off Pin Symbol IOut1-3L IOLoutLX/ IOLoutHX VOut1-6H Min. 0.3 Typ. Max. 1.6 Unit mA Type* A 2, 5, 8, 11, 20, 23 2, 5, 8, 11, 20, 23 2, 5, 8, 11, 20, 23 2, 5, 8, 11, 20, 23 5.14 1.05 1.2 2 5.15 0.5 2.5 V A 5.16 5.17 5.18 5.19 5.20 5.21 6 6.1 6.2 6.3 6.4 7 7.1 7.2 7.3 7.4 7.5 Notes: VOut1-6L tdon tdon tdoff tdoff tdon - tdoff 0.5 2.2 20 20 20 3 V s s s s s A A A A A A Dead time between V =13V corresponding high- and VS RLoad = 30 low-side switches Inhibit Input Input voltage low-level threshold Input voltage high-level threshold Hysteresis of input voltage Pull-down current Input voltage low-level threshold Input voltage high-level threshold Hysteresis of input voltage Pull-down current pin DI, VDI, VCLK = VVCC CLK Pull-up current pin CS VCS= 0V VINH = VVCC Serial Interface: Logic Inputs DI, CLK, CS 17 - 19 17 - 19 17 - 19 18 - 19 17 12 12 12 1 VIL VIH VI IPD 0.3 x VVCC 0.7 x VVCC 100 10 0.3 x VVCC 0.7 x VVCC 50 2 -50 500 50 -2 700 80 V V mV A A A A A VIL VIH VI IPDSI IPUSI V V mV A A A A A A A *) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter 1. Delay time between rising edge of input signal at pin CS after data transmission and switch on/off output stages to 90% of final level. Device not in standby for t > 1 ms. 11 4953F-AUTO-02/10 7. Electrical Characteristics (Continued) 7.5V < VS < 40V; 4.75V < VCC < 5.25V; INH = High; -40C < Tj < 200C, Ta 150C; unless otherwise specified, all values refer to GND pins. No. 8 8.1 8.2 8.3 Parameters Test Conditions Pin Symbol VDOL VDOH IDO Min. Typ. Max. 0.5 Unit V V Type* A A A Serial Interface: Logic Output DO Output voltage low level IOL = 3 mA Output voltage high level IOL = -1 mA Leakage current (tri-state) VCS = VVCC, 0V < VDO < VVCC 13 13 13 VVCC - 0.7V -10 10 A *) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter Notes: 1. Delay time between rising edge of input signal at pin CS after data transmission and switch on/off output stages to 90% of final level. Device not in standby for t > 1 ms. 8. Serial Interface: Timing Parameters Test Conditions Pin 13 13 13 13 13 17 17 Input register bit 14 (SCT) = high Input register bit 14 (SCT) = low 17 17 18 18 18 18 18 19 19 Timing Chart No. 1 2 10 4 8 9 9 5 6 7 3 11 12 Symbol tENDO tDISDO tDOf tDOr tDOVal tCSSethl tCSSetlh tCSh tCSh tCLKh tCLKl tCLKp tCLKSethl tCLKSetlh tDIset tDIHold 225 225 17 2.1 225 225 500 225 225 40 40 Min. Typ. Max. Unit 200 200 100 100 200 ns ns ns ns ns ns ns ms ms ns ns ns ns ns ns ns DO enable after CS falling edge CDO = 100 pF DO disable after CS rising edge CDO = 100 pF DO fall time DO rise time DO valid time CS setup time CS setup time CS high time CS high time CLK high time CLK low time CLK period time CLK setup time CLK setup time DI setup time DI hold time CDO = 100 pF CDO = 100 pF CDO = 100 pF 12 ATA6837 4953F-AUTO-02/10 ATA6837 Figure 8-1. Serial Interface Timing Diagram with Chart Numbers 1 2 CS DO 9 CS 4 7 CLK 5 3 6 8 DI 11 CLK 10 12 DO Inputs DI, CLK, CS: High level = 0.7 x VCC, low level = 0.2 x VCC Output DO: High level = 0.8 x VCC, low level = 0.2 x VCC 13 4953F-AUTO-02/10 9. Noise and Surge Immunity Parameters Conducted interferences Interference suppression ESD (Human Body Model) CDM (Charge Device Model) MM (Machine Model) Note: 1. Test pulse 5: Vvbmax = 40V Test Conditions ISO 7637-1 VDE 0879 Part 2 ESD S 5.1 ESD STM5.3 ESD STM5.2 Value Level 4(1) Level 5 4 kV 500V 200V 10. Application Circuit Figure 10-1. Application Circuit VS BYT41D VS Input register Ouput register Serial interface + VCC U5021M Enable Watchdog Trigger Reset S I S C T O L D H S 6 L S 6 H S 5 L S 5 H S 4 L S 4 H S 3 L S 3 H S 2 L S 2 H S 1 L S 1 S R R Vbatt 24V Charge pump GND L S 1 T P GND DI P S F I N H S C D H S 6 L S 6 H S 5 L S 5 H S 4 L S 4 H S 3 L S 3 H S 2 L S 2 H S 1 GND CLK Microcontroller GND CS Fault Detect Fault Detect Fault Detect Fault Detect Fault Detect Fault Detect UV protection VCC Power on reset VCC INH Control logic DO VCC 5V + GND VCC Fault Detect Fault Detect Fault Detect Fault Detect Fault Detect Fault Detect GND Thermal protection GND GND OUT1 OUT2 OUT3 OUT4 OUT5 OUT6 M M M M M 14 ATA6837 4953F-AUTO-02/10 ATA6837 10.1 Application Notes * Connect the blocking capacitors at VCC and VS as close as possible to the power supply and GND pins. * Recommended value for capacitors at VS: Electrolytic capacitor C > 22 F in parallel with a ceramic capacitor C = 100 nF. Value for electrolytic capacitor depends on external loads, conducted interferences and reverse-conducting current IHSX (see Section 4. "Absolute Maximum Ratings" on page 8). * Recommended value for capacitors at VCC: Electrolytic capacitor C > 10 F in parallel with a ceramic capacitor C = 100 nF. * To reduce thermal resistance, place cooling areas on the PCB as close as possible to GND pins and to the die paddle in QFN24. 15 4953F-AUTO-02/10 11. Ordering Information Extended Type Number ATA6837-PXQW Package QFN24 Remarks Taped and reeled, Pb-free 12. Package Information Package: QFN 24 - 5 x 5 Exposed pad 3.6 x 3.6 (acc. JEDEC OUTLINE No. MO-220) Dimensions in mm Not indicated tolerances 0.05 0.90.1 0.05-0.05 24 1 0.4 18 19 +0 5 3.6 24 1 technical drawings according to DIN specifications 6 0.3 13 12 7 6 0.65 nom. Drawing-No.: 6.543-5122.01-4 Issue: 1; 15.11.05 3.25 16 ATA6837 4953F-AUTO-02/10 ATA6837 13. Revision History Please note that the following page numbers referred to in this section refer to the specific revision mentioned, not to this document. Revision No. 4953F-AUTO-02/10 4953E-AUTO-09/09 History * Section 7 "Electrical Characteristics" numbers 5.10 and 5.11 on page 10 changed * Section 7 "Electrical Characteristics" number 1.7 on page 9 added * * * * * * Features on page 1 changed Table 2-1 "Pin Description QFN24" on pages 3 to 4 changed Section 4 "Abs.Max.Ratings" on page 8 changed Section 5 "Thermal Resistance" on page 8 changed Section 6 "Operating Range" on page 8 changed Section 7 "Electrical Characteristics" numbers 1.1, 1.2, 1.6, 4.1 to 4.7, 5.3, 5.4 and 5.6 to 5.9 on pages 9 to 10 changed * Section 8 "Serial Interface: Timing" on page 12 changed * Section 9 "Noise and Surge Immunity" on page 16 changed * Section 11 "Ordering Information" on page 14 changed * Section 7 "Electrical Characteristics" numbers 5.15 and 5.16 on page 10 changed * Section 9 "Noise and Surge Immunity" on page 14 changed * Put datasheet in a new template * Section 7 "Electrical Characteristics" numbers 1.5, 3.1, 5.15 and 8.2 on pages 9 to 11 changed 4953D-AUTO-10/08 4953C-AUTO-09/07 4953B-AUTO-07/07 17 4953F-AUTO-02/10 Headquarters Atmel Corporation 2325 Orchard Parkway San Jose, CA 95131 USA Tel: 1(408) 441-0311 Fax: 1(408) 487-2600 International Atmel Asia Unit 1-5 & 16, 19/F BEA Tower, Millennium City 5 418 Kwun Tong Road Kwun Tong, Kowloon Hong Kong Tel: (852) 2245-6100 Fax: (852) 2722-1369 Atmel Europe Le Krebs 8, Rue Jean-Pierre Timbaud BP 309 78054 Saint-Quentin-en-Yvelines Cedex France Tel: (33) 1-30-60-70-00 Fax: (33) 1-30-60-71-11 Atmel Japan 9F, Tonetsu Shinkawa Bldg. 1-24-8 Shinkawa Chuo-ku, Tokyo 104-0033 Japan Tel: (81) 3-3523-3551 Fax: (81) 3-3523-7581 Product Contact Web Site www.atmel.com Technical Support auto_control@atmel.com Sales Contact www.atmel.com/contacts Literature Requests www.atmel.com/literature Disclaimer: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any intellectual property right is granted by this document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH IN ATMEL'S TERMS AND CONDITIONS OF SALE LOCATED ON ATMEL'S WEB SITE, ATMEL ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT SHALL ATMEL BE LIABLE FOR ANY DIRECT, INDIRECT, CONSEQUENTIAL, PUNITIVE, SPECIAL OR INCIDENTAL DAMAGES (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS OF PROFITS, BUSINESS INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT OF THE USE OR INABILITY TO USE THIS DOCUMENT, EVEN IF ATMEL HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Atmel makes no representations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications and product descriptions at any time without notice. Atmel does not make any commitment to update the information contained herein. Unless specifically provided otherwise, Atmel products are not suitable for, and shall not be used in, automotive applications. Atmel's products are not intended, authorized, or warranted for use as components in applications intended to support or sustain life. (c) 2010 Atmel Corporation. All rights reserved. Atmel(R), logo and combinations thereof, and others are registered trademarks or trademarks of Atmel Corporation or its subsidiaries. Other terms and product names may be trademarks of others. 4953F-AUTO-02/10 |
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